The temperature difference between CPU and cooler base was measured. This allows precise adjustment of the power and contact pressure to be transmitted and highly accurate temperature measurement. The contact surfaces are milled flat with very fine grooves, which corresponds to high-quality CPU coolers. Our competent customer service is at your side with questions about our products, spare parts and in case of complaints.
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Show Thermal Interface Thermal Paste. EN Deutsch. Choose variant Charge. How is it tested? The measuring sensors in the DIE are not very accurate, so we use a laboratory device here. Often the values are stated many times too high and have nothing to do with reality. Just as important as the thermal conductivity value is the minimum layer thickness of a paste at a given contact pressure in order to minimise the temperature difference between CPU and cooler. Arctic Silver AS5 3.
Add to Basket. AS5 3. Show specifications and reviews for: AS 5 12g AS5 3. Specifications AS 5 12g AS5 3. Coverage Area 3. At a layer 0. Warranty 24 months 24 months EAN barcode Warranty 24 months EAN barcode Customer Reviews AS 5 12g. Great product for reducing CPU temperature!! Much easier to use than other similar compounds - yet to fully test thermal transfer properties.
Drop temps by 10 degrees Anonymous , 8th June Use ArctiClean first! No way of measuring how good this was in my case Ryan Cooper , 11th October I will never user anything else again Anonymous , 26th April Great product Gary Rooksby , 27th January Superb straight away!
Anonymous , 16th December Cool as Anoobis Splendid. Feb 4, 3, 0 22, 0. You just did something completely unnecessary as the pre-applied Arctic Cooling MX-1 compound on the Freezer 7 Pro works just as good better in many cases on the Freezer Series as AS5 and just as good as AS5 with other heatsinks. What is the average temperature of the room the unit is in and what kind of airflow does the case have? Your idle temps still seem like they could be improved, but they're still acceptable. Especially air cooling.
You should have 3 mm fans, plus an 80mm with that Lian-Li so you should have more than adequate case airflow and I doubt you're using the shroud but if the room is hot you can only expect so much. I would suggest re-applying the AS5 one more time. You need to completely remove any old thermal paste from both the CPU and the heatsink. I use q-tips, but a lot of people suggest a coffee filter to use to wipe away the old stuff. I believe wusy uses rubbing alcohol followed by a little turpentine.
Moisten the coffee filter or q-tip with the rubbing alcohol and start cleaning the heatsink and CPU off. Repeat with the turpentine. I would also read through the Freezer 7 Pro's instructions on properly mounting the heatsink to make sure it's seated correctly.
If you put on a decent amount of compound regardless of what kind you use, most included pastes today are pretty good , and you have good airflow in your case and a good heatsink with decent stock fan you should be fine as long as you're not OC'ing. A little too much thermal compound is better than too little. It doesn't matter if it squeezes out the sides of the die a bit, it's really not going anywhere, unless you way over applied it. Just make sure the heatsink is in good contact and that your temps are within normal range for the first couple of days and you'll be fine.
Check your temps every now and then for the first few weeks particularly in the first few days, and try some heavy gaming to test it and then again about 8 months or so down the road. For testing, you can just use an application like the graphics demo's off of nVidia's website or something.
I use the Nalu one cuz she's an f'n hot Mermaid. Running this and doing a few other things can really tax your CPU and increase your temps to near max.
Feb 24, 4, 0 22, 9. I almost always get hot up here in my loft when that system is on and I'm just glad there's a window and that I'm a guy shirt comes off. As far as not using thermal compound, I wouldn't recommend it, but with a CPU that doesn't put out a ton of heat it is possible. As long as heatsink is close to the source and the heat concentrates onto it where it can be quickly wisked off by fresh air, it IS possible to go without a heat transfer putty.
Today's CPU's run pretty hot, especially dual cores. That said, I don't know what the temp range is for Core 2 Duo's, since I don't have one, don't care, and won't be buying one I have 2 socket computers, I'm waiting for quad core now. I do know that on my X2 the temp ceiling is about 70 degrees celsius and that sounds about right for the Core 2.
AS5 is less viscous than previous versions of Arctic Silver so it stays where you put it instead of slowly seeping out the sides with vibration. It also contains finer silver, and I think perhaps more of it. However, other thermal compounds still do a fine job, such as the stuff you scraped off your heatsink.
Today's compounds for the most part are all fine unless you're OCing or your stock fan happens to be crap. On more generic brand I'd say go ahead and throw on a compound you can be sure of, but if a name brand heatsink like Zalman or one of AMD's heatsinks comes with thermal paste I'd say go ahead and use it. Making sure you're using AS5 like some people probably do is more of a peace of mind thing, and wanting to be sure you've got the best stuff. How many and what size case fans do you have?
If the air is being circulated inside of your case by that CPU fan instead of directed out; your internal case temp might be too high. A big 90 or 92mm fan or two can do wonders to keeping your mobo and CPU temps down. Jul 5, 0 18, 0. The way I always do it is: Place a small amount of thermal compound on the processor itself about the size of a grain of rice and spread it with my debit card as thinly as possible.
You could use other things obviously than a debit card but it was all that I had readily available. Jan 3, 8 0 18, 0. The important thing to understand is what you are trying to accomplish with the AS. If the chip and the cooler were perfectly flat, you wouldn't need any compound and you would have the best cooling possible. Unfortunately, there are imperfections in both so you need to fill those in with compound What you are trying to achieve is full contact no air with as little compound as possible.
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